Semiconductor

Semiconductor

Semiconductor

Physically foamed TPU sheets are engineered for semiconductor industry CMP processes, with fine uniform cellular structure and customizable compression properties, ideal as subpads or cushioning layers under polishing pads.

Target Industry
Semiconductor
Core Application
CMP process subpads /cushioning layers
Cellular Structure
Fine, uniform
Customizable Traits
Compression properties, hardness, thickness

Key Features & Benefits

Excellent Compressibility Advantage
Enables uniform pressure distribution and consistent surface contact during wafer polishing.
Fine Cell Structure Advantage
Ensures low surface defects and stable polishing performance in CMP processes.
Chemical Resistance Advantage
Withstands CMP slurries and cleaning agents, maintaining long-term durability.
imensional Stability Advantage
Keeps flatness and thickness uniformity under thermal and mechanical stress.
Customizable Hardness Advantage
Can be tailored to meet specific equipment and process hardness requirements.
Customizable Thickness Advantage
Adjusted to fit the thickness needs of different CMP equipment and processes.
Description

Our physically foamed TPU sheets are engineered to meet the demanding requirements of Chemical Mechanical Planarization (CMP) processes in the semiconductor industry. With a fine, uniform cellular structure and customizable compression properties, these foamed sheets are ideal for use as subpads or cushioning layers beneath polishing pads.

Key Features:

  • Excellent Compressibility & Resilience
    Provides uniform pressure distribution and consistent surface contact during wafer polishing.

  • Fine Cell Structure
    Ensures low surface defects and stable polishing performance.

  • Chemical Resistance
    Withstands CMP slurries and cleaning agents, maintaining long-term durability.

  • Dimensional Stability
    Maintains flatness and thickness uniformity under thermal and mechanical stress.

  • Customizable Hardness & Thickness
    Tailored to meet specific equipment and process needs.

Typical Applications:

  • Subpad for wafer CMP polishing systems

  • Cushion layer for LCD glass or optical lens polishing

  • Buffer layer in multi-layer CMP pad constructions

Available in various densities, thicknesses, and hardness levels, our TPU foam sheets deliver consistent, high-precision performance for advanced semiconductor fabrication.