
Semiconductor
Physically foamed TPU sheets are engineered for semiconductor industry CMP processes, with fine uniform cellular structure and customizable compression properties, ideal as subpads or cushioning layers under polishing pads.
Physically foamed TPU sheets are engineered for semiconductor industry CMP processes, with fine uniform cellular structure and customizable compression properties, ideal as subpads or cushioning layers under polishing pads.
Our physically foamed TPU sheets are engineered to meet the demanding requirements of Chemical Mechanical Planarization (CMP) processes in the semiconductor industry. With a fine, uniform cellular structure and customizable compression properties, these foamed sheets are ideal for use as subpads or cushioning layers beneath polishing pads.
Key Features:
Excellent Compressibility & Resilience
Provides uniform pressure distribution and consistent surface contact during wafer polishing.
Fine Cell Structure
Ensures low surface defects and stable polishing performance.
Chemical Resistance
Withstands CMP slurries and cleaning agents, maintaining long-term durability.
Dimensional Stability
Maintains flatness and thickness uniformity under thermal and mechanical stress.
Customizable Hardness & Thickness
Tailored to meet specific equipment and process needs.
Typical Applications:
Subpad for wafer CMP polishing systems
Cushion layer for LCD glass or optical lens polishing
Buffer layer in multi-layer CMP pad constructions
Available in various densities, thicknesses, and hardness levels, our TPU foam sheets deliver consistent, high-precision performance for advanced semiconductor fabrication.